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  • What is the low pressure injection molding process?

    Low pressure injection molding is a kind of packaging technology that uses a very low injection pressure (1.5-50 bar) to inject the hot melt adhesive into the mold in the molten state and solidify it rapidly. The sealed products can achieve the functions of insulation, temperature resistance, dust prevention, waterproof, moisture-proof, flame-retardant, impact resistance, vibration reduction, chemical corrosion resistance, etc. At present, low-pressure injection molding technology is widely used in the packaging and protection of precision and sensitive electronic components, including consumer electronics, medical, industrial, military, electrical, energy, automobile and other fields,

  • What is the difference between low pressure injection molding and traditional injection molding?

    Traditional injection molding, the pressure and temperature are very high, easy to cause damage to electronic components or wiring harness, while low-pressure injection molding process, low injection temperature, good protection of precision electronic components to improve the quality of products and the qualification rate in the production process.

  • Advantages of low pressure injection molding process?

    1. Low injection pressure and high safety;

    2. Improve productivity;

    3. Excellent material characteristics: chemical corrosion resistance, flame retardant, environmental protection;

    4. Reduce production cost;


  • Low pressure injection and filling process comparison?

    1. The potting process needs outer box, while the low-pressure injection molding process directly shapes the outer box, saving the cost of the outer box.

    2. There is a large amount of glue used in the filling process, and the low-pressure injection molding process directly guarantees the amount of glue used in the mold, so as to save the material cost.

    3. The curing time of the filling process is long, about a few hours to a few days, while the curing time of the low-pressure injection molding process only takes a few seconds to dozens of seconds.


  • What is the shrinkage of the material after low pressure injection?

    The shrinkage range is about 1-1.5%. The shrinkage of different materials is slightly different.

  • How to avoid bubbles during low pressure injection?

    First of all, the mold design will increase the exhaust inserts, which can avoid the bubbles in the low-pressure injection molding process to the greatest extent.

    Secondly, for products with large amount of glue, we may design several molding methods to avoid bubbles. In the small batch sample stage, transparent rubber can be selected for testing to determine whether there is bubble in the product, and then change to colored rubber after mass production.


  • What is the waterproof performance of the workpiece after low pressure injection molding?

    According to the current process, the highest level of IP67 waterproof can be achieved. If higher waterproof level is required, it needs to be combined with advanced structural waterproof.

  • What is the dimensional tolerance of low pressure injection molding process?

    0.1mm ± 4%

  • What is the cycle time of low pressure injection molding process?

    Low pressure injection molding cycle depends on the size and complexity of the workpiece. At present, the molding cycle of our large-scale low pressure injection products is about 25-60 seconds. At the same time, the design of a multi hole mold will greatly improve the production efficiency.

  • What is the injection temperature of hot melt adhesive?

    The temperature of low pressure injection molding is generally 180-200 ℃, which mainly depends on the characteristics of the compound itself.

  • Does low pressure injection mold need preheating?

    Unwanted